CENTRE DE RESSOURCES ET DE FORMATION
SUR LES PROCEDES DE FABRICATION DES CARTES ELECTRONIQUES
SUR LES PROCEDES DE FABRICATION DES CARTES ELECTRONIQUES
Parution de normes
Normes/standards ( EN )
Source : IPC Status of Standardization (www.ipc.org)
- IPC-1782A – November 2020 – Standard for Manufacturing and Supply Chain Traceability of Electronic Products
- IPC-2581C – November 2020 – Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
- IPC-2222B – October 2020 – Sectional Design Standard for Rigid Organic Printed Boards
- IPC-7093A – October 2020 – Design and Assembly Process Implementation for Bottom Termination SMT Components
- IPC-2591 Version 1.2 – September 2020 – Connected Factory Exchange (CFX), Version 1.2
- IPC-A-610H – September 2020 – Acceptability of Electronic Assemblies
- IPC-J-STD-001H-Redline – September 2020 – Requirements for Soldered Electrical and Electronic Assemblies – Redline
- IPC-WP-019B – September 2020 – An Overview on Global Change in Ionic Cleanliness Requirements
- IPC/WHMA-A-620D-S – September 2020 – Space and Military Applications Electronic Hardware Addendum to IPC/WHMA-A-620D
- J-STD-001H – September 2020 – Requirements for Soldered Electrical and Electronic Assemblies
Derniers standards/normes traduits en français
Source : IPC Status of Standardization (www.ipc.org)
- IPC/WHMA-A-620D – Juin 2020 – Exigences et acceptation des assemblages de câbles et de faisceaux de fils